Laser Ablation Workflows for Failure Analysis
Research into failure analysis (FA) in semiconductors and materials science required results faster than was possible with traditional techniques, TESCAN has responded to this need with easy-to-use, flexible laser ablation workflows.
These workflows utilize laser ablation technology which affords material removal rates over 10k times faster than a plasma FIB, accelerating time-to-results and increasing throughput. Laser ablation proves its worth when large volumes of materials (up to several mm3) need to be removed, taking just tens of minutes while a plasma FIB may take days.
TESCAN’s FA lab workflows can be provided as a total solution incorporating a micro-CT for locating regions of interest, laser ablation for rapid site excavation, plasma FIB for site polishing and FIB-SEM for detailed investigation via various analytical techniques and 3D mapping.